About the product
- Thermally enhanced ceramic particles
- 3 unique shapes and sizes of pure silver particles
- Ensures best physical contact between the heatsink and CPU core
- Will not separate, run, migrate or bleed
- 3.5g
- 99.9% pure micronized silver
- Will not separate, run, migrate or bleed
- Thermal conductance: >350 000W/m2 degreesC (0.001 inch layer)
- Easy to apply and remove
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