About the product
- Dimensions 70x22x1mm Thermal Pads Fit for NGFF M.2 2280 (22 x 80mm) PCIE NVME SSD Heatsinks.
- Efficient Thermal Conductivity12.0 W/mk heat conductivity. Made of quality thermal silica gel material with nano-aluminum oxide powder and high polymer, can effectively improve the heat transfer between the electronic elements. Lower overall temperature in short time.
- Great safety and StabilityOperating temperature: -40~200
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