About the product
- Power amplifier chip with more than 90% of the power efficiency and low idle loss characteristics.
- High-level modulation system configuration, advanced level reduces the number of components, integrated self-protection circuit, including overvoltage, undervoltage, overheating, DC detection and short circuit protection, heat-resistant package.
- With surface mounted capacitances.
- European style 3P wiring terminals.
- Big heatsink chip, convection type heat dissipation.
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